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DRAM DDR3 1Gbit 16 96/144 TFBGA 1 AT
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HerstellerMicron
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Herstellerteil #MT41K64M16TW-107 AAT:J
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Auf Lager23139
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Packaging | Tray |
| Standard Pack Qty | 1224 |
Übersicht
Description
The "AAT:J" suffix denotes specific package type and temperature range specifications, often meaning standard operating temperatures and a lead-free, RoHS-compliant package. Such memory components are commonly used in a variety of applications, including personal computers, servers, and other electronic devices that require fast and efficient memory processing capabilities. The DDR3 technology helps in reducing power consumption while maintaining higher transfer rates, making it suitable for both high-performance and energy-efficient computing needs.
Equivalent
1. Samsung K4B4G1646D-BCK0: A similar DDR3L SDRAM offering.
2. SK Hynix H5TQ4G63AFR-PBC: Another compatible DDR3L SDRAM.
3. Nanya NT5CB64M16FP-DI: A comparable DDR3L option.
4. Kingston D2516EC4BXGGB: DDR3L module with matching specs.
These equivalents should be verified for compatibility in specific applications.
Features
1. Capacity and Organization: It offers a 1Gb density, organized as 64M x 16 bits.
2. Speed and Timings: The "-107" indicates a speed grade, supporting a data rate of up to 1866 MT/s with a CL=13.
3. Voltage: It operates at a low voltage of 1.35V, which is more power-efficient compared to standard DDR3.
4. Temperature Range: The "AAT:J" indicates an industrial temperature range, from -40°C to 95°C, making it suitable for applications requiring higher thermal resilience.
5. Package: It comes in a standard 96-ball FBGA package.
6. Error Correction: It supports standard DDR3 error correction features but does not inherently provide ECC (Error-Correcting Code).
7. Applications: It is ideal for applications in computing, networking, and industrial applications where power savings and performance are critical.
These features make it suitable for a variety of high-performance applications requiring reliable and efficient memory solutions.
Pinout
This chip typically comes in a 96-ball FBGA (Fine-pitch Ball Grid Array) package. The pin count for this particular package is 96.
Key functions include:
- High-speed data transfer capabilities due to its DDR3 architecture, enabling faster data rates compared to previous generations.
- Used in applications requiring significant memory bandwidth, such as computers and servers.
- Supports various features like auto refresh, self-refresh, and a power-saving mode, contributing to efficient power management.
- Compatible with standard DDR3 interfaces, ensuring ease of integration into existing systems.
It's important to consult the specific datasheet from Micron Technology for detailed pin assignments and functional descriptions, as they can provide precise technical information for design and application purposes.